Intel Core i3-4170 i3 4170 3.7 GHz Dual-Core Quad-Thread CPU Processor 3M 54W LGA 1150
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₵111.50
393 in stock
393 in stock
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Description
Specification
Overview
| Weight | 0.060 kg |
|---|---|
| Dimensions | 20 × 20 × 5 cm |
| Brand Name |
Intel |
| Application |
Desktop |
| Support Chipset Models |
Intel B85 |
| Processor Type |
Intel Core i3 |
| Default TDP / TDP |
54 |
| Number OF Therads |
4 |
| Support Memory Type |
DDR3 |
| Origin |
Mainland China |
| Socket Type |
LGA 1150 |
| GPU-built |
YES |
| Cooling system |
no |
| Support Memory Channels |
2 |
| PCIe VERSION |
PCIe 3.0 |
| Usage Scenario |
others |
| Chip Process |
22 nanometers |
| Unlocked |
YES |
| Type |
Dual-Core |
| L3 Cache Capacity |
3 |
| Number of Cores |
Dual-Core |
| Package |
No |
| L2 Cache Capacity |
512kbMB |
Processor
| Weight | 0.060 kg |
|---|---|
| Dimensions | 20 × 20 × 5 cm |
| Brand Name |
Intel |
| Application |
Desktop |
| Support Chipset Models |
Intel B85 |
| Processor Type |
Intel Core i3 |
| Default TDP / TDP |
54 |
| Number OF Therads |
4 |
| Support Memory Type |
DDR3 |
| Origin |
Mainland China |
| Socket Type |
LGA 1150 |
| GPU-built |
YES |
| Cooling system |
no |
| Support Memory Channels |
2 |
| PCIe VERSION |
PCIe 3.0 |
| Usage Scenario |
others |
| Chip Process |
22 nanometers |
| Unlocked |
YES |
| Type |
Dual-Core |
| L3 Cache Capacity |
3 |
| Number of Cores |
Dual-Core |
| Package |
No |
| L2 Cache Capacity |
512kbMB |
Display
| Weight | 0.060 kg |
|---|---|
| Dimensions | 20 × 20 × 5 cm |
| Brand Name |
Intel |
| Application |
Desktop |
| Support Chipset Models |
Intel B85 |
| Processor Type |
Intel Core i3 |
| Default TDP / TDP |
54 |
| Number OF Therads |
4 |
| Support Memory Type |
DDR3 |
| Origin |
Mainland China |
| Socket Type |
LGA 1150 |
| GPU-built |
YES |
| Cooling system |
no |
| Support Memory Channels |
2 |
| PCIe VERSION |
PCIe 3.0 |
| Usage Scenario |
others |
| Chip Process |
22 nanometers |
| Unlocked |
YES |
| Type |
Dual-Core |
| L3 Cache Capacity |
3 |
| Number of Cores |
Dual-Core |
| Package |
No |
| L2 Cache Capacity |
512kbMB |
RAM
| Weight | 0.060 kg |
|---|---|
| Dimensions | 20 × 20 × 5 cm |
| Brand Name |
Intel |
| Application |
Desktop |
| Support Chipset Models |
Intel B85 |
| Processor Type |
Intel Core i3 |
| Default TDP / TDP |
54 |
| Number OF Therads |
4 |
| Support Memory Type |
DDR3 |
| Origin |
Mainland China |
| Socket Type |
LGA 1150 |
| GPU-built |
YES |
| Cooling system |
no |
| Support Memory Channels |
2 |
| PCIe VERSION |
PCIe 3.0 |
| Usage Scenario |
others |
| Chip Process |
22 nanometers |
| Unlocked |
YES |
| Type |
Dual-Core |
| L3 Cache Capacity |
3 |
| Number of Cores |
Dual-Core |
| Package |
No |
| L2 Cache Capacity |
512kbMB |
Storage
| Weight | 0.060 kg |
|---|---|
| Dimensions | 20 × 20 × 5 cm |
| Brand Name |
Intel |
| Application |
Desktop |
| Support Chipset Models |
Intel B85 |
| Processor Type |
Intel Core i3 |
| Default TDP / TDP |
54 |
| Number OF Therads |
4 |
| Support Memory Type |
DDR3 |
| Origin |
Mainland China |
| Socket Type |
LGA 1150 |
| GPU-built |
YES |
| Cooling system |
no |
| Support Memory Channels |
2 |
| PCIe VERSION |
PCIe 3.0 |
| Usage Scenario |
others |
| Chip Process |
22 nanometers |
| Unlocked |
YES |
| Type |
Dual-Core |
| L3 Cache Capacity |
3 |
| Number of Cores |
Dual-Core |
| Package |
No |
| L2 Cache Capacity |
512kbMB |
Video Card
| Weight | 0.060 kg |
|---|---|
| Dimensions | 20 × 20 × 5 cm |
| Brand Name |
Intel |
| Application |
Desktop |
| Support Chipset Models |
Intel B85 |
| Processor Type |
Intel Core i3 |
| Default TDP / TDP |
54 |
| Number OF Therads |
4 |
| Support Memory Type |
DDR3 |
| Origin |
Mainland China |
| Socket Type |
LGA 1150 |
| GPU-built |
YES |
| Cooling system |
no |
| Support Memory Channels |
2 |
| PCIe VERSION |
PCIe 3.0 |
| Usage Scenario |
others |
| Chip Process |
22 nanometers |
| Unlocked |
YES |
| Type |
Dual-Core |
| L3 Cache Capacity |
3 |
| Number of Cores |
Dual-Core |
| Package |
No |
| L2 Cache Capacity |
512kbMB |
Connectivity
| Weight | 0.060 kg |
|---|---|
| Dimensions | 20 × 20 × 5 cm |
| Brand Name |
Intel |
| Application |
Desktop |
| Support Chipset Models |
Intel B85 |
| Processor Type |
Intel Core i3 |
| Default TDP / TDP |
54 |
| Number OF Therads |
4 |
| Support Memory Type |
DDR3 |
| Origin |
Mainland China |
| Socket Type |
LGA 1150 |
| GPU-built |
YES |
| Cooling system |
no |
| Support Memory Channels |
2 |
| PCIe VERSION |
PCIe 3.0 |
| Usage Scenario |
others |
| Chip Process |
22 nanometers |
| Unlocked |
YES |
| Type |
Dual-Core |
| L3 Cache Capacity |
3 |
| Number of Cores |
Dual-Core |
| Package |
No |
| L2 Cache Capacity |
512kbMB |
Features
| Weight | 0.060 kg |
|---|---|
| Dimensions | 20 × 20 × 5 cm |
| Brand Name |
Intel |
| Application |
Desktop |
| Support Chipset Models |
Intel B85 |
| Processor Type |
Intel Core i3 |
| Default TDP / TDP |
54 |
| Number OF Therads |
4 |
| Support Memory Type |
DDR3 |
| Origin |
Mainland China |
| Socket Type |
LGA 1150 |
| GPU-built |
YES |
| Cooling system |
no |
| Support Memory Channels |
2 |
| PCIe VERSION |
PCIe 3.0 |
| Usage Scenario |
others |
| Chip Process |
22 nanometers |
| Unlocked |
YES |
| Type |
Dual-Core |
| L3 Cache Capacity |
3 |
| Number of Cores |
Dual-Core |
| Package |
No |
| L2 Cache Capacity |
512kbMB |
Battery
| Weight | 0.060 kg |
|---|---|
| Dimensions | 20 × 20 × 5 cm |
| Brand Name |
Intel |
| Application |
Desktop |
| Support Chipset Models |
Intel B85 |
| Processor Type |
Intel Core i3 |
| Default TDP / TDP |
54 |
| Number OF Therads |
4 |
| Support Memory Type |
DDR3 |
| Origin |
Mainland China |
| Socket Type |
LGA 1150 |
| GPU-built |
YES |
| Cooling system |
no |
| Support Memory Channels |
2 |
| PCIe VERSION |
PCIe 3.0 |
| Usage Scenario |
others |
| Chip Process |
22 nanometers |
| Unlocked |
YES |
| Type |
Dual-Core |
| L3 Cache Capacity |
3 |
| Number of Cores |
Dual-Core |
| Package |
No |
| L2 Cache Capacity |
512kbMB |
General
| Weight | 0.060 kg |
|---|---|
| Dimensions | 20 × 20 × 5 cm |
| Brand Name |
Intel |
| Application |
Desktop |
| Support Chipset Models |
Intel B85 |
| Processor Type |
Intel Core i3 |
| Default TDP / TDP |
54 |
| Number OF Therads |
4 |
| Support Memory Type |
DDR3 |
| Origin |
Mainland China |
| Socket Type |
LGA 1150 |
| GPU-built |
YES |
| Cooling system |
no |
| Support Memory Channels |
2 |
| PCIe VERSION |
PCIe 3.0 |
| Usage Scenario |
others |
| Chip Process |
22 nanometers |
| Unlocked |
YES |
| Type |
Dual-Core |
| L3 Cache Capacity |
3 |
| Number of Cores |
Dual-Core |
| Package |
No |
| L2 Cache Capacity |
512kbMB |
Customer Reviews
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In stock
| Weight | 0.650 kg |
|---|---|
| Dimensions | 20 × 20 × 30 cm |
| Brand Name |
YUDX |
| Shoes Type |
Basic |
| Origin |
Mainland China |
| Season |
Spring/Autumn |
| Upper Material |
Artificial leather |
| Fit |
Fits true to size, take your normal size |
| Model Number |
YI234 |
| Closure Type |
Lace-up |
| Item Type |
casual shoes |
| Fashion Element |
Sewing |
| Department Name |
Adult |
| Outsole Material |
Rubber |
| Pattern Type |
Solid |
| Feature |
Breathable, disposable, Height Increasing, waterproof |
| Occasion |
Casual |
| Insole Material |
PU |
| Lining Material |
PU |
| Men Light Sneakers |
Lace-Up Soft Bottom shoes |
| Men's Trendy Shoes |
Male Casual Shoes |
| Leather Shoes Men |
Little White Shoes |
| Soft Sole Leather shoes |
Zapatos Hombre |
| Slip on Boat Shoes |
Italian Soft Men Loafers |
Reviews
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