Intel Core i3-3240 i3 3240 3.4 GHz Dual-Core CPU Processor 3M 55W LGA 1155

SKU: K3W9CRSPKD57

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501 in stock

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Description

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Second-hand product.The origin is sent randomly with a one-year warranty.Due to the production process, the surface of the product is not 100% smooth and may be accompanied by scratches.

Intel Core i3-3240 specifications

General information

Type

Market segment

Desktop

Family

Model number

i3-3240

CPU part numbers

  • CM8063701137900 is an OEM/tray microprocessor

  • CM8063701247800 is an OEM/tray microprocessor

  • BX80637I33240 is a boxed processor with fan and heatsink (English version)

  • BXC80637I33240 is a boxed processor with fan and heatsink (Chinese version)

Frequency

3400 MHz

Low power frequency

1600 MHz

Bus speed

5 GT/s DMI

Clock multiplier

34

Package

1155-land Flip-Chip Land Grid Array

Socket

Socket 1155 / H2 / LGA1155

Size

1.48″ x 1.48″ / 3.75cm x 3.75cm

Introduction date

End-of-Life date

Last order date is Jun 26, 2015
Last shipment date is Dec 04, 2015

Price at introduction

$138 (OEM)
$147 (box)

S-spec numbers

Part number

ES/QS processors

Production processors

BX80637I33240

+

BXC80637I33240

+

CM8063701137900

+

+

CM8063701247800

+

Architecture / Microarchitecture

Microarchitecture

Ivy Bridge

Processor core

Core steppings

L1 (QC8J, SR0RH)
P0 (QCFX)

Manufacturing process

0.022 micron

Data width

64 bit

The number of CPU cores

2

The number of threads

4

Floating Point Unit

Integrated

Level 1 cache size

2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches

Level 2 cache size

2 x 256 KB 8-way set associative caches

Level 3 cache size

3 MB 12-way set associative shared cache

Physical memory

32 GB

Multiprocessing

Uniprocessor

Features

  • MMX instructions

  • SSE / Streaming SIMD Extensions

  • SSE2 / Streaming SIMD Extensions 2

  • SSE3 / Streaming SIMD Extensions 3

  • SSSE3 / Supplemental Streaming SIMD Extensions 3

  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4

  • AVX / Advanced Vector Extensions

  • F16C / 16-bit Floating-Point conversion instructions

  • EM64T / Extended Memory 64 technology / Intel 64

  • NX / XD / Execute disable bit

  • HT / Hyper-Threading technology

  • VT-x / Virtualization technology

Low power features

Enhanced SpeedStep technology

Integrated peripherals / components

Integrated graphics

GPU Type: HD 2500
Microarchitecture: Gen 7
Execution units: 6
Base frequency (MHz): 650
Maximum frequency (MHz): 1050
The number of supported displays: 3

Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333, DDR3-1600
Maximum memory bandwidth (GB/s): 25.6

Other peripherals

  • Direct Media Interface 2.0

  • PCI Express 2.0 interface

Electrical / Thermal parameters

Maximum operating temperature

65.3°C (case)
105°C (junction)

Thermal Design Power

55 Watt

Specification

Overview

Weight 0.060 kg
Dimensions 20 × 20 × 5 cm
Brand Name

Intel

Application

Desktop

Support Chipset Models

Intel B75

Processor Type

Intel Core i3

Default TDP / TDP

55

Number OF Therads

4

Support Memory Type

DDR3

Origin

Mainland China

Socket Type

LGA 1155

GPU-built

YES

Cooling system

no

Support Memory Channels

2

PCIe VERSION

PCIe 2.0

Usage Scenario

others

Chip Process

22 nanometers

Unlocked

YES

Type

Dual-Core

L3 Cache Capacity

3

Number of Cores

Dual-Core

Package

No

L2 Cache Capacity

512kbMBMB

Processor

Weight 0.060 kg
Dimensions 20 × 20 × 5 cm
Brand Name

Intel

Application

Desktop

Support Chipset Models

Intel B75

Processor Type

Intel Core i3

Default TDP / TDP

55

Number OF Therads

4

Support Memory Type

DDR3

Origin

Mainland China

Socket Type

LGA 1155

GPU-built

YES

Cooling system

no

Support Memory Channels

2

PCIe VERSION

PCIe 2.0

Usage Scenario

others

Chip Process

22 nanometers

Unlocked

YES

Type

Dual-Core

L3 Cache Capacity

3

Number of Cores

Dual-Core

Package

No

L2 Cache Capacity

512kbMBMB

Display

Weight 0.060 kg
Dimensions 20 × 20 × 5 cm
Brand Name

Intel

Application

Desktop

Support Chipset Models

Intel B75

Processor Type

Intel Core i3

Default TDP / TDP

55

Number OF Therads

4

Support Memory Type

DDR3

Origin

Mainland China

Socket Type

LGA 1155

GPU-built

YES

Cooling system

no

Support Memory Channels

2

PCIe VERSION

PCIe 2.0

Usage Scenario

others

Chip Process

22 nanometers

Unlocked

YES

Type

Dual-Core

L3 Cache Capacity

3

Number of Cores

Dual-Core

Package

No

L2 Cache Capacity

512kbMBMB

RAM

Weight 0.060 kg
Dimensions 20 × 20 × 5 cm
Brand Name

Intel

Application

Desktop

Support Chipset Models

Intel B75

Processor Type

Intel Core i3

Default TDP / TDP

55

Number OF Therads

4

Support Memory Type

DDR3

Origin

Mainland China

Socket Type

LGA 1155

GPU-built

YES

Cooling system

no

Support Memory Channels

2

PCIe VERSION

PCIe 2.0

Usage Scenario

others

Chip Process

22 nanometers

Unlocked

YES

Type

Dual-Core

L3 Cache Capacity

3

Number of Cores

Dual-Core

Package

No

L2 Cache Capacity

512kbMBMB

Storage

Weight 0.060 kg
Dimensions 20 × 20 × 5 cm
Brand Name

Intel

Application

Desktop

Support Chipset Models

Intel B75

Processor Type

Intel Core i3

Default TDP / TDP

55

Number OF Therads

4

Support Memory Type

DDR3

Origin

Mainland China

Socket Type

LGA 1155

GPU-built

YES

Cooling system

no

Support Memory Channels

2

PCIe VERSION

PCIe 2.0

Usage Scenario

others

Chip Process

22 nanometers

Unlocked

YES

Type

Dual-Core

L3 Cache Capacity

3

Number of Cores

Dual-Core

Package

No

L2 Cache Capacity

512kbMBMB

Video Card

Weight 0.060 kg
Dimensions 20 × 20 × 5 cm
Brand Name

Intel

Application

Desktop

Support Chipset Models

Intel B75

Processor Type

Intel Core i3

Default TDP / TDP

55

Number OF Therads

4

Support Memory Type

DDR3

Origin

Mainland China

Socket Type

LGA 1155

GPU-built

YES

Cooling system

no

Support Memory Channels

2

PCIe VERSION

PCIe 2.0

Usage Scenario

others

Chip Process

22 nanometers

Unlocked

YES

Type

Dual-Core

L3 Cache Capacity

3

Number of Cores

Dual-Core

Package

No

L2 Cache Capacity

512kbMBMB

Connectivity

Weight 0.060 kg
Dimensions 20 × 20 × 5 cm
Brand Name

Intel

Application

Desktop

Support Chipset Models

Intel B75

Processor Type

Intel Core i3

Default TDP / TDP

55

Number OF Therads

4

Support Memory Type

DDR3

Origin

Mainland China

Socket Type

LGA 1155

GPU-built

YES

Cooling system

no

Support Memory Channels

2

PCIe VERSION

PCIe 2.0

Usage Scenario

others

Chip Process

22 nanometers

Unlocked

YES

Type

Dual-Core

L3 Cache Capacity

3

Number of Cores

Dual-Core

Package

No

L2 Cache Capacity

512kbMBMB

Features

Weight 0.060 kg
Dimensions 20 × 20 × 5 cm
Brand Name

Intel

Application

Desktop

Support Chipset Models

Intel B75

Processor Type

Intel Core i3

Default TDP / TDP

55

Number OF Therads

4

Support Memory Type

DDR3

Origin

Mainland China

Socket Type

LGA 1155

GPU-built

YES

Cooling system

no

Support Memory Channels

2

PCIe VERSION

PCIe 2.0

Usage Scenario

others

Chip Process

22 nanometers

Unlocked

YES

Type

Dual-Core

L3 Cache Capacity

3

Number of Cores

Dual-Core

Package

No

L2 Cache Capacity

512kbMBMB

Battery

Weight 0.060 kg
Dimensions 20 × 20 × 5 cm
Brand Name

Intel

Application

Desktop

Support Chipset Models

Intel B75

Processor Type

Intel Core i3

Default TDP / TDP

55

Number OF Therads

4

Support Memory Type

DDR3

Origin

Mainland China

Socket Type

LGA 1155

GPU-built

YES

Cooling system

no

Support Memory Channels

2

PCIe VERSION

PCIe 2.0

Usage Scenario

others

Chip Process

22 nanometers

Unlocked

YES

Type

Dual-Core

L3 Cache Capacity

3

Number of Cores

Dual-Core

Package

No

L2 Cache Capacity

512kbMBMB

General

Weight 0.060 kg
Dimensions 20 × 20 × 5 cm
Brand Name

Intel

Application

Desktop

Support Chipset Models

Intel B75

Processor Type

Intel Core i3

Default TDP / TDP

55

Number OF Therads

4

Support Memory Type

DDR3

Origin

Mainland China

Socket Type

LGA 1155

GPU-built

YES

Cooling system

no

Support Memory Channels

2

PCIe VERSION

PCIe 2.0

Usage Scenario

others

Chip Process

22 nanometers

Unlocked

YES

Type

Dual-Core

L3 Cache Capacity

3

Number of Cores

Dual-Core

Package

No

L2 Cache Capacity

512kbMBMB

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